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Intel EUV, Packaging, and Career Ladder Updates
Intel highlights a High-NA EUV lithography milestone and EMIB-T packaging progress while renaming its 'Fellow' technical title to 'Distinguished Engineer.'
- Intel Reports High-NA EUV Milestone and Packaging Lead, Also Overhauls Technical Ladder
Intel says it has processed one million wafers using High-NA EUV lithography and is drawing praise for its EMIB-T packaging technology, while separately renaming its longstanding 'Fellow' title to 'Distinguished Engineer.'