Storyline

TSMC vs Intel Advanced Packaging Competition

TSMC is developing a 'Quasi-EMIB' packaging technology with Kinsus Interconnect to compete with Intel's EMIB as CoWoS capacity constraints push chip designers toward alternatives.

1. 8/8/2026TSMC Develops 'Quasi-EMIB' Packaging to Counter Intel's Growing Advanced Packaging Momentum

   Intel's EMIB packaging technology is reportedly drawing interest from major chip designers as TSMC's CoWoS capacity remains constrained, prompting TSMC to develop its own EMIB-like alternative with Kinsus Interconnect Technology.