3D NAND
Hardware
Kioxia and Sandisk Unveil 10th-Generation BiCS10 QLC 3D NAND With Record Density
Kioxia and Sandisk introduced their BiCS10 3D QLC NAND flash memory at the Future of Memory and Storage Conference, claiming the industry's highest areal density and a new interface speed record aimed at data center SSDs.
2 outletsHardwareSamsung Unveils zHBM, zNAND-O and BV-NAND at FMS 2026, Betting on Wafer Bonding for AI Memory
At the Future of Memory and Storage 2026 conference, Samsung introduced three next-generation memory and storage concepts—zHBM, zNAND-O, and BV-NAND—all built around advanced wafer bonding, aimed at boosting performance for AI accelerators and edge devices.
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