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Hardware
Reports Diverge on TSMC's Hybrid Bonding Plans as Industry Weighs Microbumps Against Newer Packaging Tech
A report citing supply chain sources says TSMC is holding off on hybrid bonding in favor of smaller microbumps, even as other reporting shows TSMC, Intel and AMD already shipping hybrid-bonded chips and the memory industry debates when the technology will reach HBM.
3 outletsHardwareYouTuber Builds 110cm 3D-Printed Chimney to Cool Ryzen 7 9800X3D by 19°C, No Fans Needed
Modder der8auer used the 'stack effect' to passively cool an AMD Ryzen 7 9800X3D, dropping temperatures from 90°C to 71°C with a towering 3D-printed chimney—though the setup is far too tall for any normal PC case.
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