Advanced Packaging
Business
SK hynix Breaks Ground on First U.S. HBM Packaging Plant in Indiana
SK hynix has held a groundbreaking ceremony for a $4 billion advanced packaging and testing facility for high-bandwidth memory in West Lafayette, Indiana, with mass production targeted for the second half of 2029.
2 outletsBusinessIntel Launches $15 Billion Stock Offering, Fueling Speculation Over 14A Customer Demand
Intel is raising up to $17.25 billion through a new stock sale to fund foundry expansion, a move analysts say hints the company may have finally secured external customers for its advanced 14A process node.
2 outletsBusinessTSMC Develops 'Quasi-EMIB' Packaging to Counter Intel's Growing Advanced Packaging Momentum
Intel's EMIB packaging technology is reportedly drawing interest from major chip designers as TSMC's CoWoS capacity remains constrained, prompting TSMC to develop its own EMIB-like alternative with Kinsus Interconnect Technology.
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