Skip to content
RevealedNews

TSV stacking

Business

CXMT's HBM Chips Reportedly Stuck at 25% Yield, South Korean Media Say

Chinese memory maker CXMT is said to be struggling with HBM production yields of around 25%, according to South Korean media reports cited by TechPowerUp and Wccftech, as the company works to master through-silicon via (TSV) stacking technology.

2 outlets

Get the weekly digest

The week’s stories in the categories you pick — in your inbox.

Your categories