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Intel Reports High-NA EUV Milestone and Packaging Lead, Also Overhauls Technical Ladder
Intel says it has processed one million wafers using High-NA EUV lithography and is drawing praise for its EMIB-T packaging technology, while separately renaming its longstanding 'Fellow' title to 'Distinguished Engineer.'
3 outletsBusinessTSMC Develops 'Quasi-EMIB' Packaging to Counter Intel's Growing Advanced Packaging Momentum
Intel's EMIB packaging technology is reportedly drawing interest from major chip designers as TSMC's CoWoS capacity remains constrained, prompting TSMC to develop its own EMIB-like alternative with Kinsus Interconnect Technology.
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