ASML
Intel Reports High-NA EUV Milestone and Packaging Lead, Also Overhauls Technical Ladder
Intel says it has processed one million wafers using High-NA EUV lithography and is drawing praise for its EMIB-T packaging technology, while separately renaming its longstanding 'Fellow' title to 'Distinguished Engineer.'
3 outletsBusinessChinese Chipmakers CXMT and YMTC Stockpile ASML DUV Tools for Three-Year Expansion, Report Says
A Financial Times report cited by TechPowerUp and Wccftech says Chinese memory makers CXMT and YMTC have secured enough ASML deep ultraviolet lithography tools to sustain expansion for three years, as Washington pushes for tighter export controls and domestic Chinese equipment makers race to scale up production.
2 outletsBusinessUBS: China's EUV Lithography Development Trails ASML by About 10 Years
A new UBS report finds China's progress in extreme ultraviolet (EUV) chip-making technology resembles ASML's status around 2004, suggesting Chinese manufacturers remain roughly a decade behind in this critical area, even as they may close the gap faster in older DUV lithography.
2 outletsBusinessYMTC Targets Top Spot in Global NAND Market by 2027 Ahead of Shanghai IPO
Chinese memory maker YMTC has told investors it aims to overtake Samsung and SK hynix to become the world's largest NAND flash producer by the end of 2027, as it prepares a multibillion-dollar IPO on the Shanghai Stock Exchange.
2 outletsBusinessUS Weighs Tighter Chip Export Limits on China Even as Apple Eyes Chinese Memory Suppliers
Two separate reports highlight conflicting currents in US-China tech policy: a possible push to block ASML's older DUV lithography tools from China, and a possible easing that could let Apple buy memory chips from Chinese suppliers CXMT and YMTC.
2 outletsBusinessSamsung Delays High-NA EUV Adoption, Following TSMC's Lead, Until 1nm Node in 2030
Samsung Electronics has confirmed it will hold off on adopting ASML's High-NA EUV lithography machines until its 1-nanometer (A10) process node, expected around 2030, joining TSMC in postponing use of the costly tools.
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