Foveros
Hardware
Intel Details How UCIe Interconnect Made Its Budget Wildcat Lake Chip Possible
At Hot Chips 2026, Intel explained how it used the UCIe open chiplet standard instead of its advanced Foveros packaging to build Wildcat Lake, a budget laptop chip that pairs its cutting-edge 18A node with aggressive cost cuts elsewhere in the design.
2 outletsBusinessTSMC Develops 'Quasi-EMIB' Packaging to Counter Intel's Growing Advanced Packaging Momentum
Intel's EMIB packaging technology is reportedly drawing interest from major chip designers as TSMC's CoWoS capacity remains constrained, prompting TSMC to develop its own EMIB-like alternative with Kinsus Interconnect Technology.
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