HBM
CXMT's HBM Chips Reportedly Stuck at 25% Yield, South Korean Media Say
Chinese memory maker CXMT is said to be struggling with HBM production yields of around 25%, according to South Korean media reports cited by TechPowerUp and Wccftech, as the company works to master through-silicon via (TSV) stacking technology.
2 outletsHardwareReports Diverge on TSMC's Hybrid Bonding Plans as Industry Weighs Microbumps Against Newer Packaging Tech
A report citing supply chain sources says TSMC is holding off on hybrid bonding in favor of smaller microbumps, even as other reporting shows TSMC, Intel and AMD already shipping hybrid-bonded chips and the memory industry debates when the technology will reach HBM.
3 outletsBusinessSK hynix Breaks Ground on First U.S. HBM Packaging Plant in Indiana
SK hynix has held a groundbreaking ceremony for a $4 billion advanced packaging and testing facility for high-bandwidth memory in West Lafayette, Indiana, with mass production targeted for the second half of 2029.
2 outletsHardwareChipmakers Race to Solve AI's Growing Memory Bottleneck as Costs Surge for Buyers
At Hot Chips 2026 and in recent industry disclosures, memory and chip companies described an intensifying 'memory wall' problem in AI computing, with rival approaches from d-Matrix, SK Hynix, Samsung, Micron, and Rapidus aiming to close the gap—while Nvidia has reportedly told customers to expect double-digit price increases on AI servers due to memory supply constraints.
3 outletsBusinessAnalysts Push Back on Report That TSMC Is Sitting on $1 Billion in Stranded Apple Chips
A report claiming TSMC is stuck with $1 billion worth of unpackaged Apple A20 Pro chips due to a DRAM shortage is being disputed by analyst Ming-Chi Kuo, while a Taiwanese economist says TSMC could offset any such glut by shifting production toward AI and HPC chips.
1 outletBusinessCXMT Reportedly Weighs Second Beijing Memory Fab to Expand DRAM Output
China's CXMT is reportedly considering a second DRAM fab in Beijing, seeking government-linked funding as it tries to close the gap left by Samsung and Micron's focus on AI-driven HBM chips.
2 outletsHardwareSanDisk and SK hynix Release High Bandwidth Flash Specification for AI Inference
SanDisk and SK hynix have published the first technical specification for High Bandwidth Flash (HBF) through the Open Compute Project, positioning the new NAND-based memory tier as a bridge between HBM and enterprise SSDs for AI inference systems.
3 outletsBusinessCXMT Gains Leverage Over Apple as China's Chip Self-Sufficiency Push Accelerates
Chinese memory maker CXMT has refused Apple's request for a price cut, backed by strong domestic demand from Huawei and Xiaomi, while Samsung and SK hynix explore Chinese equipment to shield their China fabs from US export controls.
2 outletsHardwareFMS 2026: Silicon Motion, Samsung, Marvell and Microchip/Micron Unveil AI-Focused Storage and Memory Technologies
At the Future of Memory and Storage 2026 conference in Santa Clara, multiple companies presented new SSD controllers, NAND architectures and PCIe Gen 6 storage designs aimed at supporting AI training, inference and emerging agentic AI workloads.
1 outletHardwareSamsung Unveils zHBM, zNAND-O and BV-NAND at FMS 2026, Betting on Wafer Bonding for AI Memory
At the Future of Memory and Storage 2026 conference, Samsung introduced three next-generation memory and storage concepts—zHBM, zNAND-O, and BV-NAND—all built around advanced wafer bonding, aimed at boosting performance for AI accelerators and edge devices.
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