Intel
Framework Cuts LPCAMM2 Memory Prices for Laptop 13 Pro, Issues Retroactive Refunds
After doubling memory prices in July due to a DRAM shortage, Framework has secured a limited supply of cheaper Micron LPCAMM2 modules and is passing on the savings—retroactively refunding customers who already paid the higher price.
3 outletsBusinessIntel Reports High-NA EUV Milestone and Packaging Lead, Also Overhauls Technical Ladder
Intel says it has processed one million wafers using High-NA EUV lithography and is drawing praise for its EMIB-T packaging technology, while separately renaming its longstanding 'Fellow' title to 'Distinguished Engineer.'
3 outletsHardwarePC GPU Shipments Rise Despite Record Prices, but Desktop and Discrete Segments Tell Mixed Story
New data from Jon Peddie Research shows overall PC GPU shipments grew in Q2, driven largely by notebooks, even as component prices soared. Reports from TechPowerUp and Tom's Hardware highlight vendor market share shifts and some differing figures on discrete desktop GPU performance.
2 outletsHardwareLeaked Slide Points to Intel's Nova Lake-S Desktop CPUs and a Multi-Generation LGA 1954 Socket
A leaked partner presentation from an Intel distributor in China outlines plans for Nova Lake-S desktop CPUs, branded Core Ultra 400, launching on a new LGA 1954 socket that Intel intends to support across multiple CPU generations.
2 outletsHardwareMicrosoft to Expand Memory Integrity Protection to More Windows 11 PCs Starting in October
Microsoft says quality updates will begin automatically enabling its kernel-level Memory Integrity security feature on more eligible Windows 11 PCs, though devices where it has been manually disabled will keep their existing settings.
2 outletsHardwareAcer Unveils Ultralight Swift Blade 14 and Swift Air 16 Laptops Ahead of IFA
Acer has introduced two new thin-and-light Windows 11 laptops, the Swift Blade 14 and Swift Air 16, both built on Intel's Wildcat Lake platform, with the Swift Blade 14 drawing attention for weighing just 799 grams.
4 outletsHardwareReports Diverge on TSMC's Hybrid Bonding Plans as Industry Weighs Microbumps Against Newer Packaging Tech
A report citing supply chain sources says TSMC is holding off on hybrid bonding in favor of smaller microbumps, even as other reporting shows TSMC, Intel and AMD already shipping hybrid-bonded chips and the memory industry debates when the technology will reach HBM.
3 outletsHardwareDell Unveils Colorful 14S Laptop at IFA, with High-End Display Option and Soldered RAM
Dell announced the 14S, a 14-inch laptop aimed at students and young professionals, featuring four distinct color options and an upgraded display, though its RAM is soldered and non-upgradable. Pricing and exact specs details vary slightly between reports.
2 outletsHardwareMSI Brings Back DDR4 in New Katana 15 Gaming Laptop Amid DRAM Price Surge
As DRAM prices soar and DDR5 costs climb, MSI is offering the Katana 15 HX C14 gaming laptop with an option for older, cheaper DDR4 memory alongside a 14th-gen Intel processor and RTX 5070 GPU.
2 outletsHardwareIntel Details How UCIe Interconnect Made Its Budget Wildcat Lake Chip Possible
At Hot Chips 2026, Intel explained how it used the UCIe open chiplet standard instead of its advanced Foveros packaging to build Wildcat Lake, a budget laptop chip that pairs its cutting-edge 18A node with aggressive cost cuts elsewhere in the design.
2 outletsBusinessAMD Reaches Record Market Share as Intel's x86 Dominance Falls to 1995 Levels
Mercury Research data shows Intel's share of the x86 CPU market has dropped below 70% for the first time in 31 years, with AMD posting record gains across desktop, laptop, and server segments even as Intel points to strong data center growth.
2 outletsHardwareIntel Reveals Xeon 7 'Diamond Rapids' Details at Hot Chips 2026: Up to 256 P-Cores, 1.28GB Cache
Intel used its Hot Chips 2026 presentation to detail the package design of its next-generation Xeon 7 'Diamond Rapids' server processors, revealing a chiplet architecture built on the 18A-P process with up to 256 P-cores, 1.28 GB of last-level cache, and a new UCIe-S based interconnect that replaces Intel's long-used EMIB packaging.
3 outletsHardwareIntel Details 'Crescent Island' AI Inference GPU at Hot Chips 2026
Intel has unveiled architectural details of its upcoming Crescent Island data center and workstation GPU, a 350W, air-cooled AI inference accelerator built on the new Xe3P architecture with up to 480 GB of LPDDR5X memory.
2 outletsHardwareIntel CPUs Break Back Into Amazon's Top 10 Best-Sellers After Months of AMD Dominance
Two Intel processors, the Core Ultra 7 270K Plus and Core i7-14700K, have re-entered Amazon's top 10 best-selling CPU list in the US, ending a long stretch in which AMD held every spot on the chart.
3 outletsBusinessSamsung Delays High-NA EUV Adoption, Following TSMC's Lead, Until 1nm Node in 2030
Samsung Electronics has confirmed it will hold off on adopting ASML's High-NA EUV lithography machines until its 1-nanometer (A10) process node, expected around 2030, joining TSMC in postponing use of the costly tools.
2 outletsBusinessNVIDIA Courts $500 Billion in Wall Street Financing for AI Buildout as China Tightens Grip on AI Talent
NVIDIA is reportedly organizing a $500 billion financing push with major Wall Street firms to fund AI infrastructure, even as its stock dipped on the news. Meanwhile, China is restricting foreign travel for AI engineers and expanding data center capacity in Inner Mongolia.
2 outletsBusinessIntel Launches $15 Billion Stock Offering, Fueling Speculation Over 14A Customer Demand
Intel is raising up to $17.25 billion through a new stock sale to fund foundry expansion, a move analysts say hints the company may have finally secured external customers for its advanced 14A process node.
2 outletsHardwareIntel Core Ultra 5 250K Plus Hits Its Lowest-Ever Price on Amazon
Amazon has cut the price of Intel's Core Ultra 5 250K Plus to around $153-$154, its lowest price since launch, with outlets calling it one of the best CPU deals of the year for gaming and productivity.
2 outletsHardwareLeak Details Power and Cache Specs for Intel's Nova Lake-S iGPU
New leaks from Intel leaker Jaykihn outline power limits, cache size, and core configurations for the integrated graphics on Intel's upcoming Nova Lake-S desktop chips, which are being positioned to compete with AMD's Ryzen APUs.
2 outletsHardwareLeak: Intel Nova Lake-S APU With 12 Xe3P Graphics Cores Said to Need 65W Just for iGPU
A new leak claims one Nova Lake-S desktop APU SKU will require a dedicated 65W power delivery segment and two VCCGT phases to unlock full integrated graphics performance, an unusual design for a desktop chip.
3 outletsHardwareTSMC Accelerates 1.4nm Chip Fab Timeline Using AI and VR Technology
TSMC's next-generation A14 (1.4nm) fab in Taiwan is reportedly on track for completion by April 2027, ahead of internal schedules, as the company deploys artificial intelligence and virtual reality tools to manage construction risks and speed up development.
2 outletsBusinessIntel Licenses Atom x86 CPU Technology to Startup RosaicLabs
Intel has granted a rare license for its Atom-class x86 CPU technology to a two-month-old startup called RosaicLabs, led by a longtime investment partner of Intel CEO Lip-Bu Tan, according to a Reuters report cited by multiple outlets.
3 outletsHardwareAMD's Zen 6: A Third 'Low-Power' Core Design Emerges, While Server Chips Hint at Big Ryzen Gains
Leaked Linux kernel patches reveal AMD is building a new Zen 6 Low-Power core that blends elements from multiple past Zen architectures, while AMD's newly unveiled Zen 6-based Epyc 'Venice-X' server chips suggest major gains in cores, cache, clocks, and efficiency for future Ryzen CPUs.
2 outletsHardwareTom's Hardware Marks 30 Years With a Look Back at Its History and Three Decades of CPU Battles
Tom's Hardware is celebrating its 30th anniversary with a series of retrospective articles, starting with the site's own founding story and a deep dive into 30 years of CPU competition between Intel and AMD, from the Pentium II era to today's Ryzen and Core chips.
1 outletHardwareLeaked Images Reveal Lenovo Googlebook 15 Ahead of Fall Launch
Leaked renderings obtained by Digital Citizen show the Lenovo Googlebook 15, an early look at Google's new laptop platform built around Gemini AI and a fresh operating system called Aluminium OS.
2 outletsHardwareGigabyte's New B850 Motherboards Highlight AMD's Expanded AM5 Chipset Lineup
Wccftech's reviews of Gigabyte's B850 AORUS Elite X3D and B850M AORUS Stealth ICE motherboards detail AMD's second-generation AM5 chipset family, the B850's feature set, and the platform's long-term socket support.
1 outletBusinessSpaceX and Tesla Unveil 'Terafab' Chip Manufacturing Plan, Now Hiring for Memory Development
SpaceX and Tesla have formally announced the first phase of Terafab, a massive semiconductor manufacturing campus in Texas, while a new job posting suggests the project is also expanding into memory chip development.
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